The cooperation between Alibaba Cloud and Black Sesame Intelligence marks a major breakthrough for domestic large models in the automotive field. Alibaba Cloud Tongyi Qianwen's large model was successfully transplanted to Black Sesame Intelligence's C1200 series car-grade chips, enabling multiple rounds of natural dialogue in an offline environment, bringing a smooth human-computer interaction experience to smart car users. This move not only demonstrates the research and development strength of domestic AI chips, but also injects new vitality into the development of the smart car industry, heralding the rapid rise of China in the field of automotive AI.
The latest cooperation between Alibaba Cloud and Black Sesame Intelligence has set off a new wave in the field of domestic smart cars. Alibaba Cloud announced that its Tongyi Qianwen 1.5 billion and 3 billion parameter large models have been successfully transplanted to Black Sesame Intelligence's Wudang C1200 series automotive-grade chips, marking an important breakthrough for domestic large models in automotive scenarios.
In practical applications, this integrated solution can support multiple rounds of natural dialogue in an offline environment, providing users with a smooth human-computer interaction experience. This technological breakthrough not only demonstrates the research and development strength of domestic AI chips, but also injects new impetus into the development of smart cars.
It is worth noting that in September 2024, Black Sesame Intelligence has launched cross-domain cooperation with Banma Smart. The two parties are committed to integrating the smart cockpit and smart driving system on a single chip to create an "integrated cabin and driving" solution. This innovative move is expected to significantly improve the intelligence level of the entire vehicle and bring users a better driving experience.
Looking to the future, Alibaba Cloud stated that it will continue to promote the adaptation of Tongyi large models and Black Sesame Intelligence's new generation Huashan A2000 series chips. The realization of this plan will bring more powerful computing power support to the field of smart travel and further enhance the in-vehicle intelligent experience.
This cooperation is an important milestone for Chinese technology companies in the field of in-vehicle AI, and reflects the determination of domestic technology to innovate on the smart car track. As technology continues to evolve, in-vehicle intelligent solutions will bring users a smarter and safer travel experience.
The success of this cooperation heralds the accelerated process of China's technological independence in the field of smart cars. In the future, more innovative technologies will be applied to in-vehicle scenarios to bring users a more convenient and comfortable driving experience. We look forward to more similar cooperation in the future to promote the vigorous development of China's smart car industry.